Sputtering apparatus
US4290876A · kind A · utility
21Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1980 |
| Grant date | Sep 22, 1981 |
| Priority date | — |
| Expiry date | Jun 5, 2000 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/268
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is disclosed a combination of a target of a material other than metals and one of opposed electrodes of a sputtering apparatus for the deposition of thin films on substrates wherein the target is soldered on the electrodes by a low-melting alloy consisting essentially of a Pb-Sn-Zn alloy and at least one additive selected from the group consisting of Sb, Al, Ti, Si, Cd and Cu. This target installation enables to prevent porous or poor heat-conducting targets from the breakage resulting from the increase of the film-forming rate or physical properties of the target material such as ceramics, glasses, resins and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.