Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
US4301324A · kind A · utility
93Cited by
12References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 6, 1978 |
| Grant date | Nov 17, 1981 |
| Priority date | — |
| Expiry date | Feb 6, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4629
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000.degree. C. while simultaneously maturing to glass-ceramics of low dielectric constant, high flexural strength and low thermal expansivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.