Apparatus for applying chemical plating to inner surfaces of tubular members
US4309959A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 1980 |
| Grant date | Jan 12, 1982 |
| Priority date | — |
| Expiry date | May 22, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S118/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus for applying chemical plating to inner surfaces of tubular members including a tank for storing a plating solution, a table for supporting a plurality of tubular members to be simultaneously plated, a plating solution distributing member connected to the storage tank via a plating solution supply line mounting a pump, and a plating solution collecting member connected to the storage tank via a plating solution return line. To provide a liquidtight seal, each tubular member to be plated is connected at its plating solution inlet end to the distributing member through a first connector and at its plating solution outlet end to the collecting member through a second connector. Each tubular member supported on the table, which is suitably inclined to allow hydrogen gas to be released through the plating solution outlet end of each tubular member to be plated, is encased in a supporting member formed of insulating material and comprising detachably attached two halves. The plating solution distributing and collecting members are similar in shape, the former having an inverted T-shape and the latter a T-shape. The storage tank is connected to a heater to keep constant the tempe…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.