Mamoru Mita
28Patents
12h-index
51Co-inventors
84Inventor score
Filing activity: May 22, 1980 → Apr 29, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5886409A | Electrode structure of wiring substrate of semiconductor device having expanded pitch | Electricity | 50 | Expired |
| US6031292A | Semiconductor device, interposer for semiconductor device | Electricity | 42 | Expired |
| US5196725A | High pin count and multi-layer wiring lead frame | Electricity | 29 | Expired |
| US6114753A | Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5866948A | Interposer for semiconductor device | Electricity | 23 | Expired |
| US6426548B1 | Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same | Electricity | 21 | Expired |
| US6137185A | Electrode structure of a wiring substrate of semiconductor device having expanded pitch | Electricity | 18 | Expired |
| US6433409B1 | Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same | Electricity | 17 | Expired |
| US6297142A | Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy | Electricity | 16 | Expired |
| US6049128A | Semiconductor device | Electricity | 15 | Expired |
| US6323058A | Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device | Electricity | 15 | Expired |
| US5837154A | Method of manufacturing double-sided circuit tape carrier | Electricity | 14 | Expired |
| US6433440B1 | Semiconductor device having a porous buffer layer for semiconductor device | Electricity | 12 | Expired |
| US6791194B1 | Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same | Electricity | 10 | Expired |
| US6130112A | Semiconductor device | Electricity | 10 | Expired |
| US8101864B2 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method | Emerging Cross-Sectional Technologies | 9 | Active |
| US5428889A | Method for manufacturing composite lead frame | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5326990A | Composite lead frame with connected inner and outer leads | Emerging Cross-Sectional Technologies | 5 | Expired |
| US8230591B2 | Method for fabricating an electronic device substrate | Emerging Cross-Sectional Technologies | 5 | Active |
| US5589668A | Multi-metal layer wiring tab tape carrier and process for fabricating the same | Electricity | 5 | Expired |
| US6506627B1 | Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device | Electricity | 4 | Expired |
| US7888697B2 | Lead frame, method of making the same and light receiving/emitting device | Electricity | 3 | Active |
| US4309959A | Apparatus for applying chemical plating to inner surfaces of tubular members | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7202570B2 | Circuit tape having adhesive film semiconductor device and a method for manufacturing the same | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7780836B2 | Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.