Sputtering apparatus
US4318796A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1980 |
| Grant date | Mar 9, 1982 |
| Priority date | — |
| Expiry date | Jul 15, 2000 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is disclosed a sputtering apparatus for the deposition of thin films of a material other than metals on substrates, comprising a pair of opposed electrodes one of which is adapted to mount a substrate, wherein a target of a material other than metals, from which thin-film-forming atoms are ejected by ion-bombardment during sputtering, is mounted on the other electrode, said target comprising at least two target members stacked on one another. This target installation prevents thin films of a material other than metals from contamination resulting from breakage of the target which in turn results from an increase of the film-forming rate or physical properties of the target material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.