High performance semiconductor package assembly
US4322778A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1980 |
| Grant date | Mar 30, 1982 |
| Priority date | — |
| Expiry date | Jan 25, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved high performance semiconductor package assembly for interconnecting a plurality of integrated circuit devices having a multilayer substrate with internal wiring including signal wiring and external signal and power connections, a plurality of integrated circuit semiconductor devices supported on the top surface of substrate in electrically connected operative relation, the improvement being a power supply distribution system for providing electrical supply voltages to the devices from the power connections consisting of radial waveguide structure including parallel waveguide planes with a low input impedence to reduce switching noise, the waveguide planes located between the signal fan-out wiring and internal wiring metallurgy and connected in common to all of the plurality of devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.