Simplified fabrication method for high-performance FET
US4325181A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 17, 1980 |
| Grant date | Apr 20, 1982 |
| Priority date | — |
| Expiry date | Dec 17, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/64
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making reproducible FET's with gate dimensions in the submiceter range, reduced source-gate channel resistance, and reduced gate and source contact resistances comprising forming, in order, on a semi-insulating substrate, of GaAs, an N-type GaAs layer, an (N+) GaAs layer and an (N++) Ge layer, using a photolith process with a mask to form the gate channel region therein, forming a refractory metal layer covering the whole top of the device, forming a gold layer on the refractory metal, using a photolith method with a common mask and etch process to cut the gate, source and drain electrodes to their desired sizes and using a plasma etch process to cut away, except for a stalk supporting the gate Au electrode, the remaining refractory metal from a portion of the gate channel lying between the gate and source electrode region and lying between the gate and drain electrode region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.