Process for in-situ modification of solder comopsition
US4332343A · kind A · utility
11Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1980 |
| Grant date | Jun 1, 1982 |
| Priority date | — |
| Expiry date | Apr 10, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Extraction of non-lead components (e.g. tin, indium, etc.) from solder joints with monocarboxylic acids of alkylated hydrophenanthrene nuclei to increase the lead content of the solder joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.