Nicholas G. Koopman
20Patents
15h-index
29Co-inventors
81Inventor score
Filing activity: Sep 3, 1976 → Oct 2, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5289631A | Method for testing, burn-in, and/or programming of integrated circuit chips | Emerging Cross-Sectional Technologies | 155 | Expired |
| US5130779A | Solder mass having conductive encapsulating arrangement | Electricity | 132 | Expired |
| US5251806A | Method of forming dual height solder interconnections | Electricity | 106 | Expired |
| US4034468A | Method for making conduction-cooled circuit package | Emerging Cross-Sectional Technologies | 69 | Expired |
| US5447264A | Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon | Electricity | 51 | Expired |
| US4463059A | Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding | Emerging Cross-Sectional Technologies | 42 | Expired |
| US4081825A | Conduction-cooled circuit package | Emerging Cross-Sectional Technologies | 35 | Expired |
| US5381946A | Method of forming differing volume solder bumps | Emerging Cross-Sectional Technologies | 35 | Expired |
| US5407121A | Fluxless soldering of copper | Electricity | 34 | Expired |
| US5048744A | Palladium enhanced fluxless soldering and bonding of semiconductor device contacts | Electricity | 33 | Expired |
| US4434434A | Solder mound formation on substrates | Electricity | 33 | Expired |
| US5499754A | Fluxless soldering sample pretreating system | Electricity | 33 | Expired |
| US4034469A | Method of making conduction-cooled circuit package | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5374893A | Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5315485A | Variable size capture pads for multilayer ceramic substrates and connectors therefor | Electricity | 21 | Expired |
| US4332343A | Process for in-situ modification of solder comopsition | Electricity | 11 | Expired |
| US5992729A | Tacking processes and systems for soldering | Electricity | 11 | Expired |
| US5412537A | Electrical connector including variably spaced connector contacts | Electricity | 10 | Expired |
| US5225711A | Palladium enhanced soldering and bonding of semiconductor device contacts | Electricity | 7 | Expired |
| US4492842A | Process of brazing using low temperature braze alloy of gold-indium tin | Performing Operations; Transporting | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.