Vacuum vapor-deposition installation with a vacuum chamber, a vaporizing chamber and an evaporizing chamber
US4338883A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 25, 1980 |
| Grant date | Jul 13, 1982 |
| Priority date | — |
| Expiry date | Aug 25, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vacuum vapor-deposition installation for batchwise operation has a horizontal valve chamber which is arranged in the middle and on which are fitted, by way of suitable openings, a top vaporizing chamber and a lower evaporizing chamber. The two openings are aligned with each other and can be sealed simultaneously in a vacuum-tight manner by a two-way valve movable horizontally in the valve chamber. For the purpose of charging the vaporizing chamber with substrates, this chamber can be lifted from the valve chamber. To solve the problem of increasing the number of production cycles per unit of time, the interior of the evaporizing chamber is accessible from the exterior without interrupting the vacuum in the valve chamber. This measure renders it unnecessary to charge the evaporizer in the evaporizing chamber through the valve chamber, for which purpose the entire chamber would have to admit air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.