Process for flattening glass-ceramic substrates
US4340436A · kind A · utility
81Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1980 |
| Grant date | Jul 20, 1982 |
| Priority date | — |
| Expiry date | Jul 14, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4629
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The obtention of enhanced planarity and dimensional integrity of sintered glass-ceramic substrates containing multi-level distribution of conductor patterns (e.g. copper) by a two stage firing of the green sheets, first between the anneal and softening points of crystallizable glass particles, interrupting the firing, superimposing selected light weights on the substrates, and heating through the coalescing temperatures to the crystallization of the glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.