Laminar thermoplastic resin structure
US4341837A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1979 |
| Grant date | Jul 27, 1982 |
| Priority date | — |
| Expiry date | Aug 7, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminar thermoplastic resin structure comprising a plurality of thermoplastic resin layers is obtained by bonding thermoplastic resin layers with a layer, or layers, of a maleic acid-modified block copolymer of a conjugated diene and an aromatic vinyl monomer interposed therebetween. The laminar structure thus obtained possesses a high bonding strength at elevated temperatures, and also excellent processability since the bonding layer per se is of thermoplastic nature. Thus, this laminar structure is particularly suitable as a material for use at elevated temperatures, for example, a packaging material for retort sterilization or a pipe for conducting hot fluids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.