Solder alloy for the direct soldering of oxide containing silver catalyst on catalyst carrier
US4344794A · kind A · utility
6Cited by
5References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 1, 1980 |
| Grant date | Aug 17, 1982 |
| Priority date | — |
| Expiry date | Dec 1, 2000 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3006
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
For soldering non-noble metal containing silver contacts on contact carriers, solders are needed which permit a direct soldering without production of an oxide free intermediae layer. This is attained with solders that consist of a silver-copper alloy with cadmium and/or tin and/or indium whereby the composition must be so selected that the liquidus temperature does not exceed 750.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.