Method and apparatus for manufacturing hybrid integrated circuits
US4345371A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1980 |
| Grant date | Aug 24, 1982 |
| Priority date | — |
| Expiry date | Mar 31, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hybrid integrated circuit is manufactured by PA1 placing chip-type circuit elements on predetermined portions of a template; PA1 preparing a printed circuit board having predetermined conductive patterns thereon and adhesive material at predetermined portions thereof; PA1 placing the printed circuit board on the template so as to bring the circuit elements into contact with the adhesive material; PA1 turning the template with the circuit board upside down and then transferring the circuit elements to the circuit board by removing the template from the circuit board; PA1 hardening the adhesive material to temporarily hold the circuit elements on the circuit board; and PA1 soldering the circuit elements to conductive patterns formed on the circuit board, so as to electrically connect the circuit elements with the conductive patterns. An element-distributing apparatus for practicing the foregoing method comprises a hopper containing a plurality of the chip-type elements, a capture element for removing the elements from the hopper, a shutter for controlling the distribution of the elements, and a template having element-receiving apertures at the predetermined locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.