Iwao Ichikawa
11Patents
8h-index
20Co-inventors
72Inventor score
Filing activity: Mar 31, 1980 → Dec 1, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5439161A | Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device | Electricity | 33 | Expired |
| US4451324A | Apparatus for placing chip type circuit elements on a board | Emerging Cross-Sectional Technologies | 22 | Expired |
| US4345371A | Method and apparatus for manufacturing hybrid integrated circuits | Emerging Cross-Sectional Technologies | 22 | Expired |
| US4457451A | Apparatus for feeding electric circuit elements | Performing Operations; Transporting | 20 | Expired |
| US5698068A | Thermocompression bonding equipment | Performing Operations; Transporting | 19 | Expired |
| US4460108A | Apparatus for feeding electric circuit elements | Electricity | 18 | Expired |
| US5568264A | Exterior view inspecting apparatus for circuit board | Electricity | 16 | Expired |
| US4336872A | Apparatus for transferring parts or the like | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5459795A | Wiring pattern inspection apparatus for printed circuit board | Physics | 3 | Expired |
| US5787191A | Wiring pattern inspection apparatus for printed circuit board | Physics | 2 | Expired |
| US6618135B2 | Laser beam inspection apparatus | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.