Automatic wafer processing system and method
US4352607A · kind A · utility
5Cited by
0References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1980 |
| Grant date | Oct 5, 1982 |
| Priority date | — |
| Expiry date | Dec 11, 2000 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B35/005
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An automatic wafer processing system is modular in format and includes wafer treatment units, storage units and air bearing transport track units which are all operatively interconnected in a coplanar configuration to provide an automated wafer flow path. To facilitate such automated system improved variable width air bearing tracks are provided by flexible strips in slots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.