Mechanical shock and impact resistant ceramic semiconductor package and method of making the same
US4355719A · kind A · utility
10Cited by
11References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 18, 1980 |
| Grant date | Oct 26, 1982 |
| Priority date | — |
| Expiry date | Aug 18, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mechanical shock and impact resistant ceramic semiconductor package is formed by applying a resilient, non-conductive, non-absorbent, heat-resistant material onto the surfaces of said package. In a dual in-line ceramic package a silicone polymer is discretely applied onto at least one end of the longitudinally opposite end edge surfaces. This renders the package mechanical shock and impact resistant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.