Inventor · Waterloo, ON, CA

Peter Weiler

13Patents
7h-index
14Co-inventors
63Inventor score

Filing activity: Aug 18, 1980 → Jul 19, 2011

Most-cited inventions

PatentTitleAreaCited byStatus
US5814847A General purpose assembly programmable multi-chip package substrate Electricity 101 Expired
US5644167A Integrated circuit package assemblies including an electrostatic discharge interposer Electricity 39 Expired
US5559056A Method and apparatus for capping metallization layer Electricity 25 Expired
US5527742A Process for coated bonding wires in high lead count packages Emerging Cross-Sectional Technologies 20 Expired
US5316976A Crater prevention technique for semiconductor processing Electricity 16 Expired
US4355719A Mechanical shock and impact resistant ceramic semiconductor package and method of making the same Electricity 10 Expired
US5424581A Crater prevention technique for semiconductor processing Electricity 9 Expired
US5455745A Coated bonding wires in high lead count packages Emerging Cross-Sectional Technologies 3 Expired
US8023406B2 Route reflector for a communication system Electricity 1 Active
US6774161B2 Process for the cold molding of particulate materials Chemistry; Metallurgy 1 Expired
US6727323B2 Process for reducing odor emission in aqueous polymer dispersions and in polymer powders Chemistry; Metallurgy 1 Expired
US6602951B2 Use of hydroperoxides as regulators in polymerizations Chemistry; Metallurgy 0 Expired
US8379514B2 Route reflector for a communication system Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.