Positive type photosensitive resin composition
US4384037A · kind A · utility
15Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 1981 |
| Grant date | May 17, 1983 |
| Priority date | — |
| Expiry date | Mar 2, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive resin composition comprising a 1,2-quanonediazide compound and a copolymer consisting essentially of (A) a conjugated diolefinic compound, (B) a monoolefinically unsaturated compound and (C) an .alpha.,.beta.-ethylenically unsaturated carboxylic acid. Said composition can provide a positive type resist which is difficult to break and excellent in adhesion to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.