Elevated edge-protected bonding pedestals for semiconductor devices
US4394678A · kind A · utility
9Cited by
15References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1979 |
| Grant date | Jul 19, 1983 |
| Priority date | — |
| Expiry date | Sep 19, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An elevated bonding pad suitable for wire or lead frame attachment and having an insulating layer completely over its outer periphery. The structure simplifies the processing required to form an elevated bonding pad, and serves to protect the periphery against bonding damage, and provides protection against corrosion of the bonded encapsulated semiconductor unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.