Thomas A. Scharr
4Patents
4h-index
6Co-inventors
43Inventor score
Filing activity: Sep 19, 1979 → Sep 28, 1992
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5346857A | Method for forming a flip-chip bond from a gold-tin eutectic | Electricity | 57 | Expired |
| US5072873A | Device for solder removal | Electricity | 10 | Expired |
| US4394678A | Elevated edge-protected bonding pedestals for semiconductor devices | Electricity | 9 | Expired |
| US4609936A | Semiconductor chip with direct-bonded external leadframe | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.