Patent · US Expired

Apparatus for cleaning semiconductor wafers

US4401131A · kind A · utility

50Cited by
5References
11Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMay 15, 1981
Grant dateAug 30, 1983
Priority date—
Expiry dateMay 15, 2001

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S134/902
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

The cleaning apparatus disclosed herein employs ultrasonic energy applied through a transducer face which overlies the entire wafer face. A cleaning liquid is introduced through the center of the transducer faceplate into the gap between the wafer and the faceplate. The transducer includes a plurality of piezoelectric transducer elements annularly distributed around the faceplate which are energized for synchronous vibration to provide an essentially uniform acoustic field over the faceplate. The faceplate is essentially flat over a majority of its surface but includes a plurality of grooves facilitating the venting of vapors created by cavitation during cleaning.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.