Masking for selective electroplating jet method
US4409071A · kind A · utility
2Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1982 |
| Grant date | Oct 11, 1983 |
| Priority date | — |
| Expiry date | Dec 27, 2002 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A low conductivity fluid mask in a predetermined fluid state is used as a mask in an electroplating jet system method. Preferred embodiments describe a deionized water mask in the liquid fluid state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.