Eric P. Dibble
8Patents
6h-index
14Co-inventors
56Inventor score
Filing activity: Dec 27, 1982 → Apr 15, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5316788A | Applying solder to high density substrates | Electricity | 140 | Expired |
| US4976626A | Connector for connecting flexible film circuit carrier to board or card | Electricity | 25 | Expired |
| US5952716A | Pin attach structure for an electronic package | Emerging Cross-Sectional Technologies | 20 | Expired |
| US4774151A | Low contact electrical resistant composition, substrates coated therewith, and process for preparing such | Emerging Cross-Sectional Technologies | 20 | Expired |
| US4849079A | Process for preparing low electrical contact resistance composition | Chemistry; Metallurgy | 10 | Expired |
| US6040631A | Method of improved cavity BGA circuit package | Electricity | 10 | Expired |
| US6438830B1 | Process of producing plastic pin grid array | Emerging Cross-Sectional Technologies | 5 | Expired |
| US4409071A | Masking for selective electroplating jet method | Chemistry; Metallurgy | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.