Microcircuit flat pack with integral shell
US4412093A · kind A · utility
15Cited by
3References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 16, 1981 |
| Grant date | Oct 25, 1983 |
| Priority date | — |
| Expiry date | Sep 16, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microcircuit flat package which remains hermetically sealed even under conditions of high stress. The package comprises an integral rectangular metal tubular shell having an opening in one of the broad walls, and elongated integral insulators sealed in the open ends of the tube, each insulator having an array of leads extending in sealed manner therethrough. A microcircuit is installed within the package and connected via wire bonds to the inner ends of the leads and after which a cover can be bonded onto the flat coplanar surfaces of the tubular shell surrounding the package opening to hermetically enclose the microcircuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.