Device fabrication incorporating liquid assisted laser patterning of metallization
US4413020A · kind A · utility
14Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1982 |
| Grant date | Nov 1, 1983 |
| Priority date | — |
| Expiry date | Feb 1, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Laser patterning of metallization is done by transmitting laser energy through a liquid film directly in contact with the metallization to be patterned. When the metal is evaporated by the laser energy, the vapor is condensed immediately by the liquid film. This prevents redeposition of metal on the patterned surface and suspends the removed metal in the liquid so that it may be reclaimed by filtration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.