Sputter system incorporating an improved blocking shield for contouring the thickness of sputter coated layers
US4416759A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1981 |
| Grant date | Nov 22, 1983 |
| Priority date | — |
| Expiry date | Nov 27, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/044
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The arbitrary contouring of thickness of a sputter-deposited film is made possible by a blocking means having a primary blocking shield and an ancillary blocking shield. The primary blocking shield intercepts atoms sputtered directly from the cathode target by line-of-sight transport. The ancillary blocking shield extends downwardly from the side of the primary blocking shield which is placed closest to the substrate. The ancillary blocking shield intercepts atoms sputtered from the cathode which by intervening gas collisions have been redirected to travel underneath the primary blocking shield. Precise tailoring of the thickness profile of the coating on the substrate is thereby provided and the quality of the composite film is maintained. The method for contouring the thickness of sputter coated layers comprises sputter coating portions of the film at successive stations. By employing the improved blocking shield at selected stations, the film in the aggregate may have the desired thickness contour.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.