Decreasing plated metal defects
US4431685A · kind A · utility
3Cited by
31References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1982 |
| Grant date | Feb 14, 1984 |
| Priority date | — |
| Expiry date | Jul 2, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/072
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of decreasing plated metal defects by applying a layer of a noble metal such as palladium, platinum, gold, iridium, rhodium, or mixtures thereof between a photoresist and a metallic surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.