John A. Welsh
19Patents
10h-index
38Co-inventors
72Inventor score
Filing activity: Jul 2, 1982 → Sep 12, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6204453A | Two signal one power plane circuit board | Electricity | 143 | Expired |
| US6453549B1 | Method of filling plated through holes | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6009620A | Method of making a printed circuit board having filled holes | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6201194A | Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric | Emerging Cross-Sectional Technologies | 28 | Expired |
| US4810326A | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces | Electricity | 18 | Expired |
| US4599134A | Plasma etching with tracer | Emerging Cross-Sectional Technologies | 18 | Expired |
| US4971715A | Phenolic-free stripping composition and use thereof | Physics | 16 | Expired |
| US6099959A | Method of controlling the spread of an adhesive on a circuitized organic substrate | Emerging Cross-Sectional Technologies | 12 | Expired |
| US4618477A | Uniform plasma for drill smear removal reactor | Electricity | 10 | Expired |
| US6750405B1 | Two signal one power plane circuit board | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7353590B2 | Method of forming printed circuit card | Emerging Cross-Sectional Technologies | 8 | Active |
| US5114518A | Method of making multilayer circuit boards having conformal Insulating layers | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6524654B1 | Method of controlling the spread of an adhesive on a circuitized organic substrate | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6432182B1 | Treatment solution for reducing adhesive resin bleed | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6986198B2 | Method of forming printed circuit card | Emerging Cross-Sectional Technologies | 3 | Expired |
| US4431685A | Decreasing plated metal defects | Electricity | 3 | Expired |
| US6274291A | Method of reducing defects in I/C card and resulting card | Electricity | 2 | Expired |
| US6488198B1 | Wire bonding method and apparatus | Emerging Cross-Sectional Technologies | 0 | Expired |
| US4918574A | Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.