Solder mound formation on substrates
US4434434A · kind A · utility
33Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1981 |
| Grant date | Feb 28, 1984 |
| Priority date | — |
| Expiry date | Mar 30, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A controlled geometric configuration of contact pads for securing solder mounds to an integrated circuit chip which reduces cracking of brittle passivating coatings in fabrication of components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.