Conductive paste
US4435611A · kind A · utility
24Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1982 |
| Grant date | Mar 6, 1984 |
| Priority date | — |
| Expiry date | Dec 23, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0305
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A novel conductive paste is disclosed which is suitable for use to connect circuit patterns of a printed circuit board. The conductive paste comprises a melt of gallium and a metal element which forms an eutectic mixture with gallium, and metal powder which alloys with gallium uniformly dispersed in the melt. The content of the metal element and the metal powder are selected to control a solid content in the paste at a predetermined working temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.