Kenji Ohsawa
43Patents
18h-index
34Co-inventors
81Inventor score
Filing activity: Dec 16, 1981 → Mar 24, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6514847B1 | Method for making a semiconductor device | Electricity | 153 | Expired |
| US5945741A | Semiconductor chip housing having a reinforcing plate | Electricity | 56 | Expired |
| US6051450A | Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus | Electricity | 45 | Expired |
| US5723900A | Resin mold type semiconductor device | Electricity | 41 | Expired |
| US5221428A | Production of lead frame | Emerging Cross-Sectional Technologies | 39 | Expired |
| US5786239A | Method of manufacturing a semiconductor package | Electricity | 38 | Expired |
| US5886399A | Lead frame and integrated circuit package | Electricity | 37 | Expired |
| US6093970A | Semiconductor device and method for manufacturing the same | Electricity | 36 | Expired |
| US4398975A | Conductive paste | Electricity | 36 | Expired |
| US4528064A | Method of making multilayer circuit board | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5349238A | Semiconductor device | Electricity | 28 | Expired |
| US5756377A | Lead frame and manufacturing method thereof | Electricity | 27 | Expired |
| US6104091A | Semiconductor package and the manufacturing method | Electricity | 25 | Expired |
| US4435611A | Conductive paste | Electricity | 24 | Expired |
| US4677252A | Circuit board | Electricity | 24 | Expired |
| US6194778A | Semiconductor package with improved cross talk and grounding, and method of manufacturing same | Electricity | 20 | Expired |
| US7374104B2 | Memory card | Physics | 19 | Active |
| US6078097A | Lead frame | Electricity | 19 | Expired |
| US5481798A | Etching method for forming a lead frame | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5982033A | Semiconductor chip package | Electricity | 18 | Expired |
| US6114755A | Semiconductor package including chip housing, encapsulation and the manufacturing method | Electricity | 18 | Expired |
| US6258631A | Semiconductor package and the manufacturing method | Electricity | 17 | Expired |
| US6074898A | Lead frame and integrated circuit package | Electricity | 16 | Expired |
| US6020626A | Semiconductor device | Electricity | 15 | Expired |
| US6054773A | Semiconductor device and method of manufacturing the same | Electricity | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.