Blocking shield and method for contouring the thickness of sputter coated layers
US4436602A · kind A · utility
16Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1983 |
| Grant date | Mar 13, 1984 |
| Priority date | — |
| Expiry date | Aug 19, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/044
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of sputter depositing a desired film thickness profile on a substrate is accomplished by depositing material onto a substrate at spaced apart coating stations whereby a substrate at any of said stations is not coated by the sputter coating action at any of the other sputter stations. The substrate is held stationary during complete sputtering at each station. A blocking shield is placed in fixed position between the substrate and the sputter coating source at one or more of the stations. The duration of sputter coating time at one station may be different than at another station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.