Apparatus for heat treating semiconductor wafers
US4436985A · kind A · utility
23Cited by
5References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 3, 1982 |
| Grant date | Mar 13, 1984 |
| Priority date | — |
| Expiry date | May 3, 2002 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B33/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In the heat treating apparatus disclosed herein, a semiconductor wafer, held in a vacuum chuck, is traversed under an infrared source in which radiant energy from a linear, high intensity lamp is focused by an elongate elliptical reflector to generate a linear target zone through which the surface of the wafer is effectively scanned by the relative motion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.