Resin composition, coating material comprising said resin composition and method for forming coatings
US4447580A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1981 |
| Grant date | May 8, 1984 |
| Priority date | — |
| Expiry date | Nov 12, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/925
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A resin composition comprising (A) a polymer having, in the molecule, at least two groups represented by the following structural formula (I): ##STR1## wherein R.sub.1 is isopropyl, sec-butyl, tert-butyl, a C.sub.5-20 alkyl group, a C.sub.3-20 cycloalkyl group, a C.sub.5-20 alkenyl group, a C.sub.3-20 hydroxyalkyl group, a C.sub.5-20 alkoxyalkyl group, a C.sub.3-20 aminoalkyl group, a C.sub.6-20 aryl group or a C.sub.6-20 arylalkyl group, and n is 0, 1 or 2, and (B) a polymer having an electron attractive group and an .alpha.,.beta.-ethylenic double bond adjacent thereto. Though said composition is stable at room temperature, it is crosslinked and cured at high temperatures because the amino group of the polymer (A) adds to the double bond of the polymer (B). Accordingly, said resin composition is suitable for use as a cathodic electrocoating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.