System for packaging of electronic circuits
US4451540A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1982 |
| Grant date | May 29, 1984 |
| Priority date | — |
| Expiry date | Aug 30, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A brazing technique is described for providing a standard flat pack with a Thermkon base brazed to a Kovar frame through the utilization of an intermediary ring of high thermal conductivity material which prevents flashing onto the Thermkon base. Brazing is accomplished either in a one-step process in which the parts with the intermediary ring are brazed together all at one time with a single heat treatment, or in a two-step process in which the intermediary ring is first brazed to the frame. In a subsequent step, the frame with the intermediary ring brazed thereto, is brazed to the Thermkon base. In either process, the high thermal conductivity of the intermediary ring permits the ring to quickly reach brazing temperature for minimizing flashing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.