Lead grounding
US4453033A · kind A · utility
24Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1982 |
| Grant date | Jun 5, 1984 |
| Priority date | — |
| Expiry date | Mar 18, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microcircuit package in which one or more leads can be grounded to the package by a simple procedure which is performed on a package of usual construction. A braze preform is placed over a lead to be grounded, a metal washer is disposed over the lead and preform, and the assembly is brazed to cause fusing of the washer to the lead and to the header to provide a low resistance grounding connection between the lead and package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.