Wafer gripping device
US4453757A · kind A · utility
16Cited by
2References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 23, 1981 |
| Grant date | Jun 12, 1984 |
| Priority date | — |
| Expiry date | Nov 23, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer gripping device including a mechanism for automatically gripping a wafer by claws for transporting a wafer between an auxiliary vacuum chamber and a vacuum chamber of a semiconductor etching device. The claws for gripping a wafer have a vertical stroke increased when a wafer gripping operation is performed to enable the wafer to be gripped without any damage being caused thereto. The wafer gripping device includes a dust collection preventing member for minimizing dust collection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.