Tin, lead, and tin-lead alloy plating baths
US4459185A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 16, 1983 |
| Grant date | Jul 10, 1984 |
| Priority date | — |
| Expiry date | Sep 16, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tin, lead or tin-lead alloy plating bath, which comprises PA1 (A) a principal plating bath containing an alkanesulfonic or alkanolsulfonic acid, and either a divalent tin salt or a divalent lead salt thereof or both; PA1 (B) at least one of surfactants comprising PA2 (a) a cationic surfactant selected from the group consisting of quarternary ammonium salts, alkyl pyridinium salts, alkyl imidazolinium salts and higher alkyl amine salts, PA2 (b) an amphoteric surfactant selected from betaines, or PA2 (c) a nonionic surfactant selected from the group consisting of condensation products of ethylene oxide and/or propylene oxide with a styrenated phenol, a higher alcohol, an alkylphenol, an alkylnaphthol, a fatty acid amide, a sorbitan or a phosphate; and PA1 (C) at least one of levelling agents selected from the group consisting of alkylidene sulfamic acids, quinolinol derivatives, benzotriazole derivatives, dialkylidene o-phenylene diamines, benzaldehyde derivatives, triazine derivatives, salicylic acid derivatives and nitriles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.