Yoshiaki Okuhama
10Patents
6h-index
29Co-inventors
66Inventor score
Filing activity: Sep 16, 1983 → Sep 4, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4459185A | Tin, lead, and tin-lead alloy plating baths | Chemistry; Metallurgy | 68 | Expired |
| US6183545A | Aqueous solutions for obtaining metals by reductive deposition | Emerging Cross-Sectional Technologies | 61 | Expired |
| US6235093A | Aqueous solutions for obtaining noble metals by chemical reductive deposition | Chemistry; Metallurgy | 19 | Expired |
| US5618404A | Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use | Chemistry; Metallurgy | 10 | Expired |
| US5651873A | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface | Electricity | 10 | Expired |
| US4673470A | Tin, lead, or tin-lead alloy plating bath | Chemistry; Metallurgy | 7 | Expired |
| US7166152B2 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method | Chemistry; Metallurgy | 6 | Expired |
| US7056448B2 | Method for forming circuit pattern | Emerging Cross-Sectional Technologies | 2 | Expired |
| US4555314A | Tin-lead alloy plating bath | Chemistry; Metallurgy | 1 | Expired |
| US12104326B2 | Decay-resistant paper | Textiles; Paper | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.