Epoxy resin composition
US4460718A · kind A · utility
15Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1983 |
| Grant date | Jul 17, 1984 |
| Priority date | — |
| Expiry date | Feb 24, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/184
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising an epoxide compound, a guanidine compound, a filler, a thixotropic agent and an organic solvent and having a thixotropy index of 5 to 40 and a viscosity of 800 to 10,000 poises (at 20.degree. C.) is suitable for forming a resist film which is used in electroless metal plating with excellent heat resistance, solder resistance and corrosion resistance, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.