Semiconductor casing
US4461924A · kind A · utility
55Cited by
17References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 21, 1982 |
| Grant date | Jul 24, 1984 |
| Priority date | — |
| Expiry date | Jan 21, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A casing for an electrical component comprises a metal base member. A metal housing member is mounted on the base member to provide a hollow enclosed casing for receiving the electrical component. A metal lead frame is provided within the enclosed casing and is electrically connected to the electrical component. The lead frame has terminal leads projecting between the base member and the housing member external to the casing. The improvement comprises an adhesive for sealing and bonding the terminal leads to both the base member and to the housing member to form the enclosed casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.