Sheldon H. Butt
51Patents
28h-index
18Co-inventors
81Inventor score
Filing activity: Dec 12, 1974 → Sep 14, 1989
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5014159A | Semiconductor package | Electricity | 104 | Expired |
| US4888449A | Semiconductor package | Emerging Cross-Sectional Technologies | 94 | Expired |
| US4882212A | Electronic packaging of components incorporating a ceramic-glass-metal composite | Emerging Cross-Sectional Technologies | 93 | Expired |
| US4849857A | Heat dissipating interconnect tape for use in tape automated bonding | Emerging Cross-Sectional Technologies | 77 | Expired |
| US4897508A | Metal electronic package | Electricity | 77 | Expired |
| US4769345A | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor | Emerging Cross-Sectional Technologies | 71 | Expired |
| US4410927A | Casing for an electrical component having improved strength and heat transfer characteristics | Electricity | 70 | Expired |
| US4491622A | Composites of glass-ceramic to metal seals and method of making the same | Emerging Cross-Sectional Technologies | 63 | Expired |
| US4866571A | Semiconductor package | Electricity | 62 | Expired |
| US4967260A | Hermetic microminiature packages | Electricity | 61 | Expired |
| US4761518A | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs | Emerging Cross-Sectional Technologies | 61 | Expired |
| US4480262A | Semiconductor casing | Electricity | 58 | Expired |
| US4461924A | Semiconductor casing | Emerging Cross-Sectional Technologies | 55 | Expired |
| US4656499A | Hermetically sealed semiconductor casing | Electricity | 54 | Expired |
| US4607276A | Tape packages | Electricity | 53 | Expired |
| US4524238A | Semiconductor packages | Electricity | 53 | Expired |
| US4594770A | Method of making semiconductor casing | Emerging Cross-Sectional Technologies | 51 | Expired |
| US4542259A | High density packages | Emerging Cross-Sectional Technologies | 49 | Expired |
| US4839716A | Semiconductor packaging | Electricity | 43 | Expired |
| US4784974A | Method of making a hermetically sealed semiconductor casing | Emerging Cross-Sectional Technologies | 40 | Expired |
| US5001546A | Clad metal lead frame substrates | Electricity | 37 | Expired |
| US4961106A | Metal packages having improved thermal dissipation | Electricity | 37 | Expired |
| US5024883A | Electronic packaging of components incorporating a ceramic-glass-metal composite | Emerging Cross-Sectional Technologies | 37 | Expired |
| US4569692A | Low thermal expansivity and high thermal conductivity substrate | Emerging Cross-Sectional Technologies | 36 | Expired |
| US4577056A | Hermetically sealed metal package | Electricity | 36 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.