Method for manufacturing IC packages
US4463892A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1982 |
| Grant date | Aug 7, 1984 |
| Priority date | — |
| Expiry date | Mar 10, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method and an article formed thereby which includes a part which is subjected to heat during fabrication of an IC package, and a fixture for holding such a part, having an arrangement for accommodating the expansion and contraction of the part during heating and cooling while holding the part in alignment. In one embodiment, the expansion and contraction arrangement comprises slots arranged as apices of a triangle in the part which receives pins in the fixture with the major axes of the slots in alignment with the point of minimum expansion and contraction of the part. Utilizing the triangulation principle, the location of the datum hole (or locating criteria), if not at the point of minimum expansion and contraction of the part, can be effectively translated to the center of minimum expansion and contraction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.