Michael D. Cusack
20Patents
6h-index
19Co-inventors
66Inventor score
Filing activity: Mar 10, 1982 → Jun 29, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4711700A | Method for densifying leadframe conductor spacing | Emerging Cross-Sectional Technologies | 38 | Expired |
| US4730160A | Programmable thermal emulator test die | Physics | 17 | Expired |
| US4753820A | Variable pitch IC bond pad arrangement | Emerging Cross-Sectional Technologies | 15 | Expired |
| US4875138A | Variable pitch IC bond pad arrangement | Emerging Cross-Sectional Technologies | 12 | Expired |
| US4959706A | Integrated circuit having an improved bond pad | Electricity | 11 | Expired |
| US7629675B2 | System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices | Electricity | 7 | Active |
| US7977773B1 | Leadframe including die paddle apertures for reducing delamination | Electricity | 5 | Active |
| US7443011B2 | System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices | Electricity | 3 | Active |
| US4463892A | Method for manufacturing IC packages | Electricity | 2 | Expired |
| USD728093S1 | Enteral feeding device | General | 2 | Active |
| US8039318B1 | System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices | Electricity | 1 | Active |
| US9986639B2 | Vertical magnetic barrier for integrated electronic module and related methods | Electricity | 1 | Active |
| US7446677B2 | Method and apparatus for optically detecting selections made on an input device | Physics | 1 | Active |
| US7495320B2 | System and method for providing a power bus in a wirebond leadframe package | Electricity | 1 | Active |
| US7745263B2 | System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices | Electricity | 1 | Active |
| US8021928B1 | System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices | Electricity | 1 | Active |
| US7202546B2 | Integrated circuit with copper interconnect and top level bonding/interconnect layer | Electricity | 0 | Expired |
| US7902655B1 | Multichip package leadframe including electrical bussing | Electricity | 0 | Active |
| US7800205B2 | Quad flat pack (QFP) package and flexible power distribution method therefor | Electricity | 0 | Active |
| US8269334B1 | Multichip package leadframe including electrical bussing | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.