Semiconductor casing
US4480262A · kind A · utility
58Cited by
9References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1982 |
| Grant date | Oct 30, 1984 |
| Priority date | — |
| Expiry date | Jul 15, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. An adhesive seals and bonds the metal base member and plastic housing member to the lead frame so as to enclose the electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.