Transducer structures employing ceramic substrates and diaphragms
US4481497A · kind A · utility
49Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1982 |
| Grant date | Nov 6, 1984 |
| Priority date | — |
| Expiry date | Oct 27, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49103
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A hybrid transducer employing a ceramic substrate having on a surface a suitable geometry for defining an active or clamped area, a semiconductor strain gage is positioned on said substrate within said active area and connections are made to said gage by conductors printed on said substrate by thick or thin film techniques. Thick film printing techniques or thin film deposition techniques are employed to print the conductors, terminal areas, compensating resistors and stop members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.