Method of measuring contact stress at contacting surfaces of abutting solid masses
US4484475A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1982 |
| Grant date | Nov 27, 1984 |
| Priority date | — |
| Expiry date | Nov 9, 2002 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0421
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of measuring a contact stress at contacting surfaces of solid masses of a same kind or different kinds by utilizing an ultrasonic wave, including the steps of causing an ultrasonic wave to impinge onto the contacting surfaces; comparing an acoustic wave of the ultrasonic wave reflected from the contacting surfaces with an acoustic wave of the ultrasonic wave transmitted through the contacting surfaces (4); and measuring the contact stress using the value of the comparison as the index of evaluation, whereby measuring non-destructively, easily, quantitatively and with a high precision, the contact stress of the contacting surfaces of parts or members constituting, for example, a machine or equipment in their stationary as well as dynamic conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.