Microwave chip carrier
US4487999A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 1983 |
| Grant date | Dec 11, 1984 |
| Priority date | — |
| Expiry date | Jan 10, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49123
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An all-metal microwave chip carrier is provided with subminiature ceramic feedthroughs, each configured to function as a coaxial cable having a predetermined impedance. In one embodiment, the feedthroughs are formed by providing ceramic tubing metallized inside and out in which the ends are cut away to provide half-cylindrical bonding pads. In order to permit bonding directly to the feedthrough, a flat wire lead is soldered to the channel in the ceramic tube, with the ends of the flat wire extending onto the flat portions of the half-cylindrical portions of the feedthrough. In one embodiment, the chip carrier includes a base, ring, and stepped lid, all of Kovar or other suitable material, with the lid being weldable to the ring rather than being brazed or soldered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.