Thermoelectric device and method of making and using same
US4489742A · kind A · utility
21Cited by
5References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1983 |
| Grant date | Dec 25, 1984 |
| Priority date | — |
| Expiry date | Jul 21, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/01
Abstract
An invention is disclosed which provides improved thermoelectric devices and methods of making and using the same. The device exhibits enhanced efficiency and operating life through the use of a bonding material comprising at least 75% busmuth together with an adherent metallic layer interposed between the boundary structure and correspondary thermoelectric semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.